2019 OCP Regional Summit

At the regional summit in 2018 KPN presented the challenges a Telco has when they want to deploy a pre-populated, pre-cabled rack into a legacy Telco location. Together with OCP platinum member Schneider Electric, KPN has been working on a solution for these challenges and will jointly present their ideas to the OCP community in this talk.

The OCP Advanced Cooling Solution (ACS) Cold Plate work stream are generating a Liquid Cooling Cold Plate Requirements document. This document focuses on liquid cooling definitions, cooling component selections, and requirements for liquid cooled solutions. The document is specifically focused on rack manifold distributed cooling within the Technology Cooling System (TCS) fluid loop. This is the fluid loop from the Coolant Distribution Unit (CDU) to the rack, through the manifold and the IT equipment, and then back through the manifold to the CDU. The liquid cooling solutions for the IT equipment spans all levels of liquid cooling, from hybrid solutions where both air and liquid cooling is used to full liquid installations where only liquid cooling is used. The definitions and selection of liquid cooling components include TCS cooling loop components such as: the cooling liquid, CDU, rack manifold, quick disconnect couplings, and cold plates. The document stresses the importance of ensuring material compatibility between the cooling liquid and all the materials that are exposed to the cooling liquid, which are referred to as wetted materials, to minimize any long term risks of corrosion. The liquid cooling requirements are determined to address quality, safety, management, and monitoring of liquid cooled installations. The target is to have the requirements document approved by the OCP Incubation Committee before the Regional Summit Meeting, and to present the approved document at the Summit.

Door Heat Exchanger (HEx) is an on-going work stream under the Advanced Cooling Solutions (ACS) sub-project. Following-up on discussions since the global summit, this presentation is meant to outline updates to the specification and spur feedback from the community. Within the specification, areas of physical interfaces, performance/metrology, monitoring/control, serviceability and testing will be covered in detail.

As a part of the ACS Door HEX group, we would like to present the Door HEX Step 2 compatible to the specification. Technical details, feasibility etc.

The continued demand for increased compute performance comes with an increase in server power and power density. The increased server power requires more efficient cooling capabilities compared to traditionally used air cooling. Direct liquid cooling using cold plates can provide the needed cooling capability, as well as fit within a small volume to allow for greater server and compute density in the rack. Even though liquid cooling is not a new cooling strategy for IT equipment, the industry is not ready to efficiently mass deploy liquid cooling solutions. Therefore, Intel is working to enable liquid cooling ingredients with industry partners. The intent is to create more available, lower risk, and faster time to market opportunity for OEMs to deploy liquid cooling solutions. Intel’s efforts are specifically focused on manifold distributed liquid cooling at the server rack level (i.e. the technology cooling system, TCS). The TCS is the fluid loop providing the cooling liquid from the Cooling Distribution Unit (CDU) through the rack manifold to the IT equipment cold plates, and then back again to the CDU through the rack manifold. The liquid cooling ingredients in the secondary loop included in Intel’s enabling efforts are: cooling liquid, CDU, interchangeable Universal Quick Disconnects (UQD), and cold plates. Intel’s enabling efforts, together with Intel’s strategy to enable these ingredients was first introduced at the OCP Global Summit in March 2019, and an update on the eco-system enabling status will be presented at the OCP Regional Summit.

This session covers the way in which Asperitas designs IT platforms by maximising the benefits of OCP hardware and combining it with immersion technology.

With the improvement of computing performance, the power consumption is significantly increased. Increasing power consumption of server components brings enormous challenges to heat dissipation and power optimization. Immersion cooling completely breaking the air-cooling power dissipation bottleneck and also achieving extremely low PUE. This presentation introduces the problems encountered by Alibaba in the scale deployment of immersion cooling data center, solutions and considerations.

This will be an overview of the work the group is doing on the Open Rack V3 Specification.

Overview of Open Rack V3 Power and Battery system.

In the past sessions I have presented team's work on challenges and solutions for Interoperability covering both electrical and Mechanical aspects of the ORV2 design. In this session I plan to present a methodology as to how the team takes those learnings to develop interoperability specifications.

The 44OU was developed to read the demands of the US telco customer. The upper busbars are flexible, that the networking switches can be installed. This work was done in cooperation with Penguin